LTE标准模组系列
- BM816
- TDD-LTE/FDD-LTE/WCDMA/EVDO/CDMA1x/EDGE/GPRS/GSM/GPS Cellular Module
- Platform: Qualcomm MDM9607
- Package: miniPCIE
- PeakRate（DL/UL）: 150Mbps/50Mbps
- Operation temperature: -40℃ to +85℃
- Dimension: 51.0 X 30.0 X 4.7mm
- BM817C
- TDD-LTE/FDD-LTE/WCDMA/EVDO/CDMA1x/EDGE/GPRS/GSM/GPS Cellular Module
- Platform: Qualcomm MDM9607
- Package: LCC
- PeakRate（DL/UL）: 150Mbps/50Mbps
- Operation temperature: -40℃ to +85℃
- Dimension: 32.5 X 30.0 X 2.5mm
- BM818
- TDD-LTE/FDD-LTE/WCDMA/EVDO/CDMA1X/EDGE/GPRS/GSM/GPS Cellular Module
- Platform: Qualcomm MDM9607
- Package: M.2
- PeakRate（DL/UL）: 150Mbps/50Mbps
- Operation temperature: -40℃ to +85℃
- Dimension: 42.0 X 30.0 X 2.3mm
- BM916
- TDD-LTE/FDD-LTE/WCDMA/EVDO/CDMA1X/EDGE/GPRS/GSM/GPS Cellular Module
- Platform: Qualcomm MDM9640
- Package: miniPCIE
- PeakRate（DL/UL）: 600Mbps/75Mbps
- Operation temperature: -40℃ to +85℃
- Dimension: 51.0 X 30.0 X 4.7mm
- BM916R
- TDD-LTE/FDD-LTE/WCDMA/EVDO/CDMA1X/EDGE/GPRS/GSM/GPS Cellular Module
- Platform: Qualcomm MDM9640
- Package: miniPCIE
- PeakRate（DL/UL）: 300Mbps/75Mbps
- Operation temperature: -40℃ to +85℃
- Dimension: 51.0 X 30.0 X 4.7mm
